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TC650/TC651
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
E
E1
p
D
2
B
n
1
α
A
A2
c
β
(F)
L
φ
A1
Units
INCHES
MILLIMETERS*
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
Pitch
n
p
.026 BSC
8
0.65 BSC
8
Overall Height
A
-
-
.043
- -
1.10
Molded Package Thickness
Standoff
A2
A1
.030
.000
.033
-
.037
.006
0.75
0.00
0.85
-
0.95
0.15
Overall Width
Molded Package Width
Overall Length
E
E1
D
.193 TYP.
.118 BSC
.118 BSC
4.90 BSC
3.00 BSC
3.00 BSC
Foot Length
L
.016 .024
.031
0.40
0.60
0.80
Footprint (Reference)
F
.037 REF
0.95 REF
Foot Angle
φ
0° - 8°
0°
-
8°
Lead Thickness
c
.003
.006
.009
0.08
-
0.23
-
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
α
β
.009
5° 5°
5° 5°
.012
-
-
.016
15°
15°
0.22 -
5° -
5° -
0.40
15°
15°
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
JEDEC Equivalent: MO-187
Drawing No. C04-111
? 2004 Microchip Technology Inc.
DS21450C-page 11
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